직무소개
반도체공정설계 (Semiconductor Process Design)
“반도체 소자에 대한 이해를 바탕으로 센서의 화소(Pixel)를 설계하고, 공정 Integration 이해를 바탕으로 공정 평가 및 개선 방안을 수립하고 제품 사양에 적합한 Package 설계 및 Simulation 개발하는 직무”
"With an understanding of semiconductor devices, this role involves designing sensor pixels, evaluating and improving processes based on process integration knowledge, and developing package designs and simulations that meet product specifications."
Role
- CMOS Image Sensor Cell(Pixel) 개발
- DRAM cell, Flash cell, Logic Transistor와 유사한 CIS용 cell 개발 업무
- Mobile CIS pixel용 Photodiode(PN junction), Pixel Transistor(MOSFET) 소자 설계
- Pixel 광학 특성 개선, 차세대 소재 물성 분석 및 신소재 공정 개발
- 차세대 Pixel 구조 설계 및 공정 개발 (3D depth, Automotive 등)
- 파운드리 공정 평가
- 파운드리 공정 PPA 평가와 다양한 공정 간 특성 비교를 통해 제품별 최적 공정 도출
- 설계 target 대비 Si의 갭 분석 및 공정 PDK 와 Si 간 특성 비교(MHC)
- PPA 개선을 위한 설계 관점의 공정 개선안, 공정 신규 Feature 검토(DTCO)
- 신규 공정 개발 성과 지표, 위험도 평가 및 관리
- 양산 제품 수율 개선 (Test결과 해석, 개선안 검토 등)
- CMOS Image Sensor Cell (Pixel) Development
- Develop CIS cells similar to DRAM cells, Flash cells, and Logic Transistors.
- Design photodiodes (PN junction) and pixel transistors (MOSFETs) for mobile CIS pixels.
- Improve pixel optical characteristics, analyze the properties of next-generation materials, and develop new material processes.
- Design next-generation pixel structures and develop processes (e.g., 3D depth, Automotive applications).
- Foundry Process Evaluation
- Derive optimal processes for each product by evaluating PPA (Power, Performance, Area) and comparing characteristics across various processes.
- Conduct gap analysis between design targets and silicon (Si), and compare process PDK with silicon characteristics (MHC).
- Review process improvements and new features from a design perspective to enhance PPA (DTCO).
- Evaluate and manage new process development performance indicators and associated risks.
- Improve mass production yield by analyzing test results and reviewing improvement plans.
- Package Solution 기획, 설계 및 개발
- 고객 기준의 Package 사양 결정 및 신규 Package 양산성 검토
- 제품 경쟁력 향상을 위한 신규 Package 공정/소재 발굴
- Low Power High Performance를 위한 PSI(Power and Signal Integrity) 설계 및 Simulation
- Thermal Simulation을 통한 Chip/Package 설계 가이드
- Chip/Package Level Simulation (Thermal, 구조, 소재) 및 Solution 개발
- Package Solution Planning, Design, and Development
- Determine package specifications based on customer standards and review the manufacturability of new packages.
- Identify new package processes/materials to enhance product competitiveness.
- Design and simulate PSI (Power and Signal Integrity) for low power and high performance.
- Provide chip/package design guidelines through thermal simulation.
- Develop chip/package-level simulations (thermal, structural, materials) and solutions.
Recommended Subject
- 전기전자 : 반도체물성/소자, 반도체 공정, 아날로그 회로, 전자기학, 광학 등
- 재료/금속 : 반도체 재료 및 소자, 재료공학개론, 결정구조, 재료물성 등
- 화학/화공 : 반도체집적공정, 유기/무기 화학, 물리화학 등
- 기계 : 고체역학, 유체역학, 열역학, 동역학 등
- 물리 : 반도체물리, 고체의 성질, 양자역학, 전자기학, 플라스마 기초 등
- Electrical and Electronics: Semiconductor Properties/Devices, Semiconductor Processes, Analog Circuits, Electromagnetics, Optics, etc.
- Materials/Metals: Semiconductor Materials and Devices, Introduction to Materials Engineering, Crystal Structures, Material Properties, etc.
- Chemistry/Chemical Engineering: Semiconductor Integrated Processes, Organic/Inorganic Chemistry, Physical Chemistry, etc.
- Mechanical Engineering: Solid Mechanics, Fluid Mechanics, Thermodynamics, Dynamics, etc.
- Physics: Semiconductor Physics, Properties of Solids, Quantum Mechanics, Electromagnetics, Basic Plasma Physics, etc.
Requirements
- Solid State device physics, Surface, Interface Physics / Chemistry 관련 지식 보유자
- 광학 관련 지식 보유자 (photonic crystal, plasmonics, metamaterial 등)
- 광전 소자/소재 개발 및 특성 분석 경험자 (photodiode, solar cell, LED, Laser 등)
- In-depth knowledge of solid-state device physics, surface physics, and interface physics/chemistry.
- Strong understanding of optics, including photonic crystals, plasmonics, and metamaterials.
- Hands-on experience in developing and characterizing optoelectronic devices/materials, such as photodiodes, solar cells, LEDs, and lasers.
Pluses
- Solid State Device Physics, Surface, Interface Physics / Chemistry 관련 지식 보유자
- 광학 관련 지식 보유자 (photonic crystal, plasmonics, metamaterial 등)
- 광전 소자/소재 개발 및 특성 분석 경험자 (photodiode, solar cell, LED, Laser 등)
- Semiconductor Process Integration 관련 경험/지식 보유자
- Si-based CMOS/Analog Circuit Design 관련 경험/지식 보유자
- Solid-state device physics, surface physics, and interface physics/chemistry.
- Optics, including photonic crystals, plasmonics, and metamaterials.
- Development and characterization of optoelectronic devices/materials, including photodiodes, solar cells, LEDs, and lasers.
- Semiconductor process integration.
- Si-based CMOS and Analog Circuit Design.
